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SILICONE HEAT SINK COMPOUND EG-10 - E.G BOND

Bin No : 133407

0.950 KWD

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Usually delivered in 3 business days after order confirmation. Please check Delivery Policy

PRODUCT DETAILS

Model	EG-10
Temperature range	-50^oC to +200^oC
Thermal conductivity	0.9 W/MK
Quantity	10 g
Made	UK

Recommended where the efficiency and reliable thermal coupling of electrical and electronic components is required or between any surface here thermal conductivity or heat dissipation is important

solder paste heat sink compound EG-10 compound