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SILICONE HEAT SINK COMPOUND EG-10 - E.G BOND


Bin No : 133407


0.950 KWD

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PRODUCT DETAILS

Model

EG-10

Temperature range

-50oC to +200oC

Thermal conductivity

0.9 W/MK

Quantity

10 g

Made

UK

 

  • Recommended where the efficiency and reliable thermal coupling of electrical and electronic components is required or between any surface here thermal conductivity or heat dissipation is important

solder paste heat sink compound EG-10 compound

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